From October 11 to 13, 2024, the 2024 China Mobile Global Partner Conference was held in Guangzhou Pazhou Poly World Trade Expo Center with the theme of “Intelligent Rebirth, Co-create the AI+ Era”. As China Mobile’s highest-specification, largest-scale, and most widely covered annual event, the conference fully showcased the latest digital and intelligent achievements of China Mobile and its global partners. As an important partner of China Mobile, Zentel took the theme of “Co-fueling Computility Engine, High-Bandwidth Memory Promotes the AI+ Era” and brought modules, chips, SSDs and other products, as well as high-bandwidth storage technology solutions and implementation results to the partner conference. In the conference, Zentel show the willing to create a highland of digital and intelligent innovation and talk about the new future of the AI+ era with China Mobile.
Zentel focuses on independent intellectual property rights and intelligent memory products. It has a product line covering mainstream DRAM memory types and is a leading chip design and product service provider in the industry. In the direction of innovative technologies such as high-bandwidth storage, storage and computing integration, and memory pooling, Zentel continues to improve its intellectual property accumulation and achieve technological breakthroughs. At this partner conference, Zentel also fully shared its smart IoT storage, high-performance storage and smart storage-related products and applications with exhibitors and people from all sectors of society.
The demand for customized DRAM design has emerged
By adopting the DRAM three-dimensional architecture of Wafer On Wafer, high-bandwidth and high-capacity performance can be achieved to empower edge computing, high-performance computing and other scenarios. And it can gradually evolve from 1-layer logic + 1-layer DRAM to 1-layer logic + N-layer DRAM, achieving high bandwidth while significantly increasing memory capacity.
High-bandwidth storage adds new momentum to AI chips
Currently, high-bandwidth storage has become the mainstream memory solution for AI acceleration, and is used in AI acceleration chips for various large model training and reasoning scenarios. In 2026, the global high-bandwidth storage market size is expected to grow by more than 3 times.
The importance of “middle-path” processes increases
Advanced packaging, represented by 2.5D/3D packaging, is between front-end wafer manufacturing and back-end traditional packaging and testing, and its importance as a “middle-path link” increases; according to the cost reduction and convergence principle of Moore’s Law, advanced packaging, as an effective means to improve chip performance, is expected to accelerate penetration and growth, and take over the AI wave.Technology is the primary productive force, and innovation is the driving force behind the company’s development. With nearly 20 years of R&D experience and IP accumulation, Zentel has mastered a variety of mature technologies from product R&D design, verification and testing, quality control to mass production and shipment, and has met the needs of hundreds of customers around the world over the years. After that, Zentel will also deepen its domestic information and innovation business, continue to make efforts in the field of high-bandwidth memory, and work closely with upstream and downstream partners in the communications industry to help China’s AI+ new era.